Name: Semiconductor Packaging Market Size, Share, Trends and Growth Report – Global Opportunities &amp; Forecast, 2023-2030
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Semiconductor Packaging Market Size, Share, Trends and Growth Report – Global Opportunities & Forecast, 2023-2030

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Semiconductor Packaging Market is expected to witness a CAGR of approximately 6.8% during the forecast period, 2023-2030.

Semiconductor Packaging Market

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Major Semiconductor Packaging Market Drivers

The global semiconductor packaging market is predicted to grow significantly due to continuous development in semiconductor technologies, widespread utilization of semiconductor materials in different industries such as end-user electronics, the automotive industry, and IT & telecommunication coupled with a rise in the adoption of artificial intelligence, and internet of things. Continuous developments in semiconductor technology, leading to the advancement of faster, smaller, and many more power-efficient chips, have increased the requirement for developed packaging approaches to effectively handle these updated semiconductor devices. The Internet of Things revolution has seen extensive adoption in different segments such as automotive, healthcare, smart home applications, and industrial automation. IoT devices in these domains often demand specialized semiconductor packages characterized by compact form factors, low power consumption, and high reliability.

The evolution of electronic hardware needs the usage of computing power that can provide not only high performance, bandwidth, and speed but also low latency and power consumption. Furthermore, the hardware requirement is to offer a different series of functionalities, integrate effortlessly at the system level, and maintain cost-effectiveness. Developed packaging technologies are well-positioned to address the varied performance requirements and complex heterogeneous integration demands. This offers businesses the opportunity to address flexible requirements in high-performance computing, 5G, and AI. Additionally, the transition from 4G to 5G technology brings about significantly faster communication speeds and increased facility. Meeting these requirements entails modern semiconductor components capable of handling higher frequencies and data rates. The deployment of small base stations and antennas for 5G infrastructure necessitates more compact and integrated components. Semiconductor packaging technology developments have made higher levels of integration and miniaturization possible, proving important for 5G hardware. In response to the need for 5G technology, new packaging materials with improved electrical and thermal properties have been developed. The functionality of 5G devices relies on materials such as organic substrates, developed substrates, and improved interconnects.

The higher frequency bands embedded by 5G require specialized semiconductor devices with developed performance. To meet the demanding requirements of 5G devices, new materials, and packaging technologies have been developed. Millimeter wave frequencies used in 5G networks demand specific semiconductor components. Precise packing techniques are essential to preserve the integrity of signal and decrease losses linked with these high-frequency signals. Moreover, developed packaging technologies facilitate higher levels of integration, thereby developing the performance of semiconductor devices. Modern packaging techniques such as System-in-Package and 3D packaging allow the stacking of different components within an individual package. The outcome is faster processing times, decreased battery consumption, and developed functionality. Efficient heat dissipation management becomes important with the escalating power of processors. Heat dissipation techniques in developed packaging technologies include microchannels, Through-silicon vias, and developed thermal interface materials. These materials play an important role in confirming effective thermal management guaranteeing the reliable and stable function of semiconductor devices.

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In addition, advanced packaging techniques enable for greater personalization in terms of package functionality and design. Semiconductor producers are personalized packages to precise application demands, accommodating the different requirements of different industries and applications. Advanced packaging techniques enable the creation of minor and more portable semiconductor packages, important for applications with restricted space such as wearable, IoT, and mobile devices. The usage of small form factors also leads to end products that are lighter and more portable. Furthermore, the significant increase in the use of customer electronics, propelled by a global rise in per capita income, and the substantial affordability of electronic and connected devices due to changes in living standards, is predicted to contribute to the growth of semiconductor packaging market size globally. Advancements in customer electronics products such as fitness bands, smartwatches, laptops, tablets, and many others, which require complex semiconductor integration, are predicted to drive the growth of global semiconductor packaging market in the forecast period.

The growth of the semiconductor packaging market could encounter challenges due to the significant initial investment needed for the development, design, and establishment of packaging units tailored to different industries including automotive, IT & and telecommunications, aerospace and defense, customer electronics, and many more. Additionally, a shortage of technical awareness within the semiconductor packaging market is predicted to act as a restraint in the market growth.

On the contrary, the substantial increase in the adoption of 3D semiconductor packaging technology is predicted to introduce different growth opportunities for market players in the global market in the forecast period. The significant increase in customer demand for lighter, portable, and smaller end-use goods, coupled with the necessity for volumetric system miniaturization and interconnection, drives the semiconductor fabrication approach to meet the need for high performance within the smaller space. The advantages of 3D semiconductor packaging result in more compact goods compared to traditional semiconductor packaging. Moreover, it enables simplified system-level circuit routing for effective direct chip-to-chip interconnection, thereby decreasing the cost of the system. These factors are predicted to create new market trends and opportunities.

By End User, Consumer Electronics Segment Registered the Largest Market Size in the Global Market

The growth of consumer electronics segment is attributed to the significant growth in demand for electronic devices equipped with 5G, AI, and IoT. There is a substantial global market for customer electronics, encompassing game consoles, smartphones, tablets, laptops, and many others. The semiconductor chips that serve as the foundation for these devices are in high requirement. The consumer electronics sector encompasses a different series of products with different capabilities and specifications. The need for semiconductor components per device is predicted to increase, specifically with the necessity for 5G smartphones to exhibit higher power efficiency, faster speeds, and many more complex functionalities. Subsequently, the consumer electronics industry is predicted to observe a substantial increase in the need for semiconductor packaging solutions.

Semiconductor Packaging Market

Moreover, personal computers and laptops have become indispensable for tech-savvy young consumers. Innovation and development in the electronics segment are predicted to drive semiconductor packaging sales in the forecast period. The sales of semiconductor packaging are estimated to grow in both developing and developed countries due to a significant surge in the integration of IoT and AI technologies in automated and connected devices. Nonetheless, gaming has evolved as one of the fastest-growing entertainment types in the recent years. Nonetheless, gaming has emerged as one of the fastest-rising forms of entertainment during recent years. Based on Dataprot, as of 2023, it is nearly 3.24 billion games globally. Although, nearly 52% of gamers are subscribed to at least one gaming service which indicates a substantial segment market. Sony’s recent earnings release highlights the robust performance of its console, with 7.1 million PS5s shipped in the last quarter of 2022, nearly doubling the figures from the same period the previous year.

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By Region, Asia Pacific Region is Predicted to Hold Largest Revenue Share Globally in the Forecast Period

The Asia Pacific region is recognized for its high-volume semiconductor production and widespread adoption of developed packaging technologies in industries such as automotive, telecommunications, and consumer electronics. These dynamics are predicted to propel the growth of the semiconductor packaging market around the region, offering lucrative market growth opportunities for key market players. Moreover, China holds the top position, generating the highest revenue in the global semiconductor packaging market. The semiconductor packaging industry is well-established in both Taiwan and China. The rapid rise in sales of customer electronics products further contributes to the overall growth of the market. The growth of the semiconductor packaging market revenue is further presenting a positive impact due to a rise in defense expenditure and the extensive usage of semiconductor materials in the IT & telecommunication, automotive industries, and consumer electronics.

Semiconductor Packaging Market

Top Market Players

Various notable players operating in the market include ASE Group, Amkor Technology, Jcet/Stats Chippac Ltd, Siliconware Precision Industries Co. Ltd (Spil), Powertech Technology Inc., Tianshui Huatian Technology Co. Ltd, Fujitsu Semiconductor Ltd, UTAC Group, Chipmos Technologies Inc., Chipbond Technology Corporation, Intel Corporation among others.

Key Developments

- In 2023, Amkor Technology joined hands with GlobalFoundaries to enable an all-inclusive EU/US supply chain from semiconductor wafer manufacture at GlobalFoundaries to OSAT services at Amkor’s facility around Porto, Portugal.
- In 2023, Samsung Elec launched turnkey services of foundry packages to take on an international leader TSMC during considerable growth in the sector of AI.
- In 2023, Intel successfully announced the advancement of an advanced semiconductor packaging i.e., Foveros Omni to enable the stacking of different dies on the top of each other, thereby leading to significant advancement in power efficiency and high performance.

Segments covered in the Report:

The Global Semiconductor Packaging Market has been segmented on the basis of Packaging Platform, End-user Industry. Based on the Packaging Platform, the market is segmented into Advanced Packaging, Traditional Packaging. Based on the End-user Industry, the market is segmented into Aerospace and Defense, Consumer Electronics, Automotive Industry, Medical Devices, Energy and Lighting, Communications and Telecom.

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Report Coverage	Details
Market Revenues (2022)	USD Million
Market Base Year	2022
Market Forecast Period	2023-2030
Base Year & Forecast Units	Revenues (USD Million)
Market Segment	By Packaging Platform, By End-user Industry, By Region
Regional Coverage	Asia Pacific, Europe, North America, and RoW
Companies Profiled	ASE Group, Amkor Technology, Jcet/Stats Chippac Ltd, Siliconware Precision Industries Co. Ltd (Spil), Powertech Technology Inc., Tianshui Huatian Technology Co. Ltd, Fujitsu Semiconductor Ltd, UTAC Group, Chipmos Technologies Inc., Chipbond Technology Corporation, Intel Corporation, among others; a total of 11 companies covered.
25% Free Customization Available	We will customize this report up to 25% as a free customization to address our client’s specific requirements

Market Segmentation