Thin wafer market by Process (Temporary Bonding & Debonding and Carrier-Less Approach), By Application (MEMS, CIS, Memory, RF Devices, LED, Interposers, Logic, and Others), By Wafer Size (125MM, 200MM, and 300MM), By Technology (Wafer Grinding, Wafer Polishing, and Wafer Dicing) and By Region – Global Opportunities & Forecast, 2022-2029
1. Executive Summary
1.1. Key Market Insights
2. Introduction
2.1. Study Objectives
2.2. Market Definition
2.2.1. Market Covered
2.2.2. Regional Coverage
2.2.3. Study Years & Currency
2.3. Market Stakeholders
2.4. Key Questions this Study will Answer
2.5. GMI Research’s Approach & Methodology
2.5.1. Research Data
2.5.2. Primary Data
2.5.3. Demand Side and Supply Side Analysis
2.5.4. Market Size Estimation
2.5.5. Research Assumptions
3. Global Thin Wafer Market- Overview
3.1. Introduction
3.2. Market Segmentation
3.3. Value Chain Analysis
3.4. Market Drivers
3.5. Market Restraints
3.6. Market Trends
4. Global Thin Wafer Market Revenue Forecast till 2029
5. Global Thin Wafer Market by Process Revenue Forecast till 2029
5.1. Temporary Bonding & Debonding
5.1.1. UV-Release Adhesives
5.1.2. Thermal-Release Adhesives
5.1.3. Solvent-Release Adhesives
5.2. Carrier-less Approach (Taiko Process)
6. Global Thin Wafer Market by Application Revenue Forecast till 2029
6.1. MEMS
6.2. CIS
6.3. Memory
6.4. RF Devices
6.5. LED
6.6. Interposers
6.7. Logic
6.8. Others
7. Global Thin Wafer Market by Wafer Size Revenue Forecast till 2029
7.1. 125 mm
7.2. 200 mm
7.3. 300 mm
8. Global Thin Wafer Market by Technology Revenue Forecast till 2029
8.1. Wafer Grinding
8.2. Wafer Polishing
8.3. Wafer Dicing
9. Global Thin Wafer Market by Region Forecast till 2029
9.1. North America Thin Wafer Market Revenue Forecast till 2029
(Option 1: As a part of the free 25% customization)
9.1.1. North America Thin Wafer Market by Process
9.1.1.1. Temporary Bonding & Debonding
9.1.1.1.1. UV-Release Adhesives
9.1.1.1.2. Thermal-Release Adhesives
9.1.1.1.3. Solvent-Release Adhesives
9.1.1.2. Carrier-less Approach (Taiko Process)
9.1.2. North America Thin Wafer Market by Application
9.1.2.1. MEMS
9.1.2.2. CIS
9.1.2.3. Memory
9.1.2.4. RF Devices
9.1.2.5. LED
9.1.2.6. Interposers
9.1.2.7. Logic
9.1.2.8. Others
9.1.3. North America Thin Wafer Market by Wafer Size
9.1.3.1. 125 mm
9.1.3.2. 200 mm
9.1.3.3. 300 mm
9.1.4. North America Thin Wafer Market by Technology
9.1.4.1. Wafer Grinding
9.1.4.2. Wafer Polishing
9.1.4.3. Wafer Dicing
9.1.5. US Thin Wafer Market All-Up
9.1.6. Canada Thin Wafer Market All-Up
9.2. Europe Thin Wafer Market Revenue Forecast till 2029
(Option 2: As a part of the free 25% customization)
9.2.1. Europe Thin Wafer Market by Process
9.2.1.1. Temporary Bonding & Debonding
9.2.1.1.1. UV-Release Adhesives
9.2.1.1.2. Thermal-Release Adhesives
9.2.1.1.3. Solvent-Release Adhesives
9.2.1.2. Carrier-less Approach (Taiko Process)
9.2.2. Europe Thin Wafer Market by Application
9.2.2.1. MEMS
9.2.2.2. CIS
9.2.2.3. Memory
9.2.2.4. RF Devices
9.2.2.5. LED
9.2.2.6. Interposers
9.2.2.7. Logic
9.2.2.8. Others
9.2.3. Europe Thin Wafer Market by Wafer Size
9.2.3.1. 125 mm
9.2.3.2. 200 mm
9.2.3.3. 300 mm
9.2.4. Europe Thin Wafer Market by Technology
9.2.4.1. Wafer Grinding
9.2.4.2. Wafer Polishing
9.2.4.3. Wafer Dicing
9.2.5. UK Thin Wafer Market All-Up
9.2.6. Germany Thin Wafer Market All-Up
9.2.7. France Thin Wafer Market All-Up
9.2.8. Spain Thin Wafer Market All-Up
9.2.9. Rest of Europe Thin Wafer Market All-Up
9.3. Asia-Pacific Thin Wafer Market Revenue Forecast till 2029
(Option 3: As a part of the free 25% customization)
9.3.1. Asia-Pacific Thin Wafer Market by Process
9.3.1.1. Temporary Bonding & Debonding
9.3.1.1.1. UV-Release Adhesives
9.3.1.1.2. Thermal-Release Adhesives
9.3.1.1.3. Solvent-Release Adhesives
9.3.1.2. Carrier-less Approach (Taiko Process)
9.3.2. Asia-Pacific Thin Wafer Market by Application
9.3.2.1. MEMS
9.3.2.2. CIS
9.3.2.3. Memory
9.3.2.4. RF Devices
9.3.2.5. LED
9.3.2.6. Interposers
9.3.2.7. Logic
9.3.2.8. Others
9.3.3. Asia-Pacific Thin Wafer Market by Wafer Size
9.3.3.1. 125 mm
9.3.3.2. 200 mm
9.3.3.3. 300 mm
9.3.4. Asia-Pacific Thin Wafer Market by Technology
9.3.4.1. Wafer Grinding
9.3.4.2. Wafer Polishing
9.3.4.3. Wafer Dicing
9.3.5. China Thin Wafer Market All-Up
9.3.6. India Thin Wafer Market All-Up
9.3.7. Japan Thin Wafer Market All-Up
9.3.8. Rest of APAC Thin Wafer Market All-Up
9.4. RoW Thin Wafer Market Revenue Forecast till 2029
(Option 4: As a part of the free 25% customization)
9.4.1. RoW Thin Wafer Market by Process
9.4.1.1. Temporary Bonding & Debonding
9.4.1.1.1. UV-Release Adhesives
9.4.1.1.2. Thermal-Release Adhesives
9.4.1.1.3. Solvent-Release Adhesives
9.4.1.2. Carrier-less Approach (Taiko Process)
9.4.2. RoW Thin Wafer Market by Application
9.4.2.1. MEMS
9.4.2.2. CIS
9.4.2.3. Memory
9.4.2.4. RF Devices
9.4.2.5. LED
9.4.2.6. Interposers
9.4.2.7. Logic
9.4.2.8. Others
9.4.3. RoW Thin Wafer Market by Wafer Size
9.4.3.1. 125 mm
9.4.3.2. 200 mm
9.4.3.3. 300 mm
9.4.4. RoW Thin Wafer Market by Technology
9.4.4.1. Wafer Grinding
9.4.4.2. Wafer Polishing
9.4.4.3. Wafer Dicing
9.4.5. Brazil Thin Wafer Market All-Up
9.4.6. South Africa Thin Wafer Market All-Up
9.4.7. Saudi Arabia Thin Wafer Market All-Up
9.4.8. UAE Thin Wafer Market All-Up
9.4.9. Rest of world (remaining countries of the LAMEA region) Thin Wafer Market All-Up
10. Competitive Landscape Analysis
10.1. Porter’s Five Forces Analysis
10.2. Industry – Competitive Landscape
10.3. Market Presence (Intensity Mapping)
10.4. Key Strategic Market Developments
11. Company Profiles (Option 5: Free 25% Customization - Profiles of 5 Additional Companies of your Choice)
11.1. SK Siltron Co., Ltd.
11.1.1. Company Overview
11.1.2. Key Executives
11.1.3. Footprint & Employee Strength
11.1.4. Product Offerings
11.1.5. Financials
11.1.6. Key Company Developments
11.2. Shin-Etsu Chemical Co., Ltd.
11.2.1. Company Overview
11.2.2. Key Executives
11.2.3. Footprint & Employee Strength
11.2.4. Product Offerings
11.2.5. Financials
11.2.6. Key Company Developments
11.3. Siltronic
11.3.1. Company Overview
11.3.2. Key Executives
11.3.3. Footprint & Employee Strength
11.3.4. Product Offerings
11.3.5. Financials
11.3.6. Key Company Developments
11.4. SUMCO CORPORATION
11.4.1. Company Overview
11.4.2. Key Executives
11.4.3. Footprint & Employee Strength
11.4.4. Product Offerings
11.4.5. Financials
11.4.6. Key Company Developments
11.5. Globalwafers Co. Ltd.
11.5.1. Company Overview
11.5.2. Key Executives
11.5.3. Footprint & Employee Strength
11.5.4. Product Offerings
11.5.5. Financials
11.5.6. Key Company Developments
11.6. Lintec Corporation
11.6.1. Company Overview
11.6.2. Key Executives
11.6.3. Footprint & Employee Strength
11.6.4. Product Offerings
11.6.5. Financials
11.6.6. Key Company Developments
11.7. DISCO Corporation
11.7.1. Company Overview
11.7.2. Key Executives
11.7.3. Footprint & Employee Strength
11.7.4. Product Offerings
11.7.5. Financials
11.7.6. Key Company Developments
11.8. 3M
11.8.1. Company Overview
11.8.2. Key Executives
11.8.3. Footprint & Employee Strength
11.8.4. Product Offerings
11.8.5. Financials
11.8.6. Key Company Developments
11.9. Applied Materials
11.9.1. Company Overview
11.9.2. Key Executives
11.9.3. Footprint & Employee Strength
11.9.4. Product Offerings
11.9.5. Financials
11.9.6. Key Company Developments
11.10. Nissan Chemical Corporation
11.10.1. Company Overview
11.10.2. Key Executives
11.10.3. Footprint & Employee Strength
11.10.4. Product Offerings
11.10.5. Financials
11.10.6. Key Company Developments
12. About GMI Research
*Details on Financials might not be available in case of unlisted/private companies.
- Published Date: Sep-2021
- Report Format: Excel/PPT
- Report Code: UP1460A-00-0620
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Report is shared with unlimited user (employees) of the purchasing corporation only
The report is used by the purchaser (One Individual) only
Multi-User License:Report is shared with maximum 5 users (employees) including the purchaser of the purchasing corporation only
Corporate License:
Report is shared with unlimited user (employees) of the purchasing corporation only
Thin wafer market by Process (Temporary Bonding & Debonding and Carrier-Less Approach), By Application (MEMS, CIS, Memory, RF Devices, LED, Interposers, Logic, and Others), By Wafer Size (125MM, 200MM, and 300MM), By Technology (Wafer Grinding, Wafer Polishing, and Wafer Dicing) and By Region – Global Opportunities & Forecast, 2022-2029
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